姓名：李婧
职称：副教授，硕士生导师
方向：柔性传感材料与器件、集成电路封装
系别：微电子系
团队：射频微波电路与微系统封装
邮箱：lijing1@cuit.edu.cn
【个人简介】
李婧，女，博士研究生学历，博士学位。近年来，在国内外高水平期刊和重要学术会议上发表论文10余篇。主研多项国家自然科学基金项目等国家级纵向科研项目，主持多项横向课题。担任国际SCI期刊《ACS Applied Materials & Interfaces》《Advanced Materials Interfaces》、《Sensors and Actuators A-Physical》等审稿专家。
【主讲课程】
本科生课程：《集成电路封装与测试》、《Verilog数字系统设计》
【科研成果】
一、发表论文
1.Jing Li, Hai Nie, Guoyun Zhou, et al.High-resolution temperature sensor fabricated with composed PEDOT: PSS/CuPc for electronic skin[J]. Sensors and Actuators A-Physical, 2023,363:114706.
2.JingLi, Guoyun Zhou, Yan Hong, et al. Highly sensitive, flexible and wearable piezoelectric motion sensor based on PT promoted β-phase PVDF[J]. Sensors and Actuators A-Physical, 2022, 37:113415.
3.JingLi, Guoyun Zhou, Yan Hong, et al. A catalytic interfacing PEDOT:PSS/CuPc polymerized on cloth fiber to electro-metalize stretchable copper conductive pattern[J]. Advanced Materials Interfaces, 2021, 2101462.
4.JingLi, Guoyun Zhou, Yan Hong, et al. Copolymer of pyrrole and 1,2-butanediol diglycidyl as an efficient additive leveler for through-hole copper electroplating[J]. ACS Omega, 2020, 5:4868-4874.
5. Jing Xiang, Shouxu Wang,Jing Li, et al. Electrochemical factors of leverlers on plating uniformity of through-holes: simulation and experiments[J]. Journal of The Electrochemical Society, 2018, 165(9): E359-E365.
6. Zhihua Tao, Wei He,Jing Li, et al. Texraoxa-diphosphaspiro derivative as suppressor for microvia filling by copper electroplating in acidic solution[J]. Journal of The Electrochemical Society, 2017, 164(14): D1032-D1041.
7. Li Zheng, Chong Wang,Jing Li, et al. Investigation of benzoquinone as a new type of Cu electroplating additive[C]. 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2017: 231-233.
二、授权专利
1.李婧等. 一种差分信号接口可复用的数据采集方法及系统：CN202610037111.2[P]. 2026-02-13.
2.李婧等. 一种用于直接电镀的表面处理工艺及其相关直接电镀工艺: CN201910429468.5 [P]. 2021-09-24.
3.陶志华，何为，李婧，等. 一种用于铜互连HDI电镀填孔的抑制剂及电镀铜浴: CN201710535976.2 [P]. 2018-08-21.
【获奖情况】
1.2019年，教育部科技进步奖二等奖，电子电路互连特种电子化学品关键技术及应用
